Intel Discrete GPU / Arctic Sound / Xe

Discussion in 'Grafičke kartice & VR oprema' started by Ragnarok, Dec 3, 2017.

  1. Reventon

    Reventon Veteran foruma

    EL NINO CFC and Esh like this.
  2. Reventon

    Reventon Veteran foruma

  3. Esh

    Esh HWB

    Haha, pa dobro, nije zabranjeno, dobru su ekipu skupili, sigurno je i dosta inženjera prešlo bez puno pompe. Pravo pitanje se odnosi na performanse finalnog proizvoda i drivera.
     
  4. Konjislav

    Konjislav Komšija

    Bi li ti presao da ti kompanija X (ili realno bilo koja druga) ponudi 10 puta vecu platu nego sto sada imas?
    Naravno da bi, nema to veze sa Intelom.
     
  5. Reventon

    Reventon Veteran foruma

    Ja bih presao i za x2 vecu... Kakve to ima veze, niti imam sta protiv ovoga gore slucaja, cak sta vise bolje je za konkurenciju. Kazem samo kako je jak Intel, jer taj covjek je bio nivo ili dva ispod Jansena. A sa sobom ce povuci jos inzinjera koji vec sada rade na buducim projektima.
    Mogli bi kupiti komplet AMD i Nvidiu da nisu pravno sprijeceni.
     
  6. Reventon

    Reventon Veteran foruma

  7. Reventon

    Reventon Veteran foruma

  8. Reventon

    Reventon Veteran foruma

  9. Neso

    Neso Komšija

    Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology.

    [​IMG]
    "As Moore's law scaling reaches its limit, the role of 3D-TSV technology is expected to become even more critical. We want to be at the forefront of this state-of-the-art chip packaging technology."

    Relying on its 12-layer 3D-TSV technology, Samsung will offer the highest DRAM performance for applications that are data-intensive and extremely high-speed.

    https://www.techpowerup.com/259885/...rst-12-layer-3d-tsv-chip-packaging-technology
     
    Esh likes this.
  10. EL NINO CFC

    EL NINO CFC Veteran foruma

  11. Esh

    Esh HWB

  12. Esh

    Esh HWB